With FlipChip platform technology, LUXEON UV FC Line contains both 1mm2 and 2mm2 die sizes and is the smallest and highest power density (W/cm2) ultraviolet with FlipChip Technology in a Chip Scale Package (CSP) LED that can be reflowed onto a substrate with standard surface mount (SMT) equipment and process. LUXEON UV FC Line LEDs enable tighter beam control and high packing density of LEDs on a chip on board solution and completely eliminate wire bonds in the system. LUXEON UV FC Line is the ideal choice for cost sensitive applications to achieve high irradiance at high current density, maximizing W/$ by taking advantage of lowest thermal resistance of a CSP device.

Features & Benefits

  • Ultraviolet wavelength range of 380nm to 420nm for a range of options
  • Micro sized CSP: 1.0mm2 package for design flexibility and packing density
  • No wire bonds allows for direct attach and reflow
  • 5-sided emitter with batwing radiation pattern
  • Low thermal resistance for leading system level W/$
  • Maximum drive current of 1A/mm2 delivers superior flux for reduced LED count
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  • Specialty Lighting
    • Analytical Instrumentation
    • Curing
    • Medical
    • Security
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LUXEON UV FC1 product performance at 500mA and 1000mA, Tj=25°C.

Peak Wavelength (nm) Typical Radiometric Power
Part Number
500mA 1000mA
410-420 650 1228 LxF3-U410100006001
750 1417 LxF3-U410100007001
400-410 650 1228 LxF3-U400100006001
750 1417 LxF3-U400100007001
390-400 550 1039 LxF3-U390100005001
650 1228 LxF3-U390100006001
750 1417 LxF3-U390100007001
380-390 350 661 LxF3-U380100003001
450 850 LxF3-U380100004001
530 1001 LxF3-U380100005001


Design Resources